Maisam Dubai supplies EPO-TEK® H20E A/B, a two-component, 100% solids, silver-filled epoxy adhesive engineered for microelectronic, optoelectronic, thermal management, and semiconductor die-attach applications. Known globally for its reliability and NASA-approved low-outgassing performance, H20E is the industry standard for high-power electronics, precision chip bonding, LED packaging, and RF/microwave assemblies.
Designed to withstand high wire-bonding temperatures (300–400°C) and compatible with high-speed automated dispensing systems, EPO-TEK H20E provides exceptional electrical conductivity, thermal transfer, and mechanical strength.
Available Packaging:
• Dual-component kits (Part A & Part B)
• Frozen syringes
• Multiple volume configurations
NASA-approved low-outgassing formulation; USP Class VI biocompatible.
Electrically conductive silver-filled epoxy with ≤ 0.0004 Ω-cm resistivity.
Exceptional thermal conductivity: 2.5 W/m·K (standard) and up to 29 W/m·K (thermal resistance method).
Capable of resisting thermal wire bonding at 300–400°C.
Long pot life: 2.5 days at room temperature.
Multiple rapid-cure options including 150°C/1 hr, 150°C/5 min, 120°C/15 min, 80°C/3 hrs.
High reliability for die-attach, flip-chip, and optoelectronic assembly.
Bonds well to Au, Ag, Ag-Pd, Cu, and metallized substrates.
Smooth thixotropic paste ideal for dispensing, screen printing, and stamping.
Proven performance in semiconductor, LED, RF/microwave, and aerospace electronics.
EPO-TEK® H20E A/B is a high-performance, two-component, silver-filled epoxy used extensively in the semiconductor, microelectronics, and aerospace industry. Formulated with 100% solids and no solvents, H20E offers superior electrical conductivity and consistent mechanical strength, making it ideal for die-attach, component bonding, high-power LED packaging, and heat-sinking applications.
H20E maintains excellent stability during long-term thermal cycling, boasting a glass transition temperature ≥ 80°C, Shore D hardness of 75, and superior adhesion strength (>3,500 psi die shear). Its high thermal performance allows it to approach eutectic solder capability, making it suitable for high-power components and harsh environments.
EPO-TEK H20E is widely adopted for semiconductor IC packaging, flip-chip assemblies, microwave/RF devices, solar photovoltaics, fiber optic components, and EMI/RF shielding. It adheres strongly to precious metals and common PCB materials and can be applied via syringe dispensing, metal-mesh screen printing, dot-stamping, or manual deposition.
Its long history of field-proven success—over 1 trillion chips bonded using H20E at a single manufacturer with zero failures (per page 2 of TDS)—makes it one of the most reliable electrically conductive adhesives in the world.
Semiconductor die-attach for ICs and MEMS.
High-power LED chip bonding and heat-sink attachment.
Flip-chip and surface mount interconnects.
Fiber optic component bonding (laser diodes, waveguides, detectors).
RF/microwave module assembly.
Thermal interface bonding for heat-generating components.
Conductive bonding for PCB pads, sensors, and PZT components.
Solar cell stringing and concentrator chip attachment.
Semiconductor & IC Packaging
Microelectronics & Hybrid Circuits
Optoelectronics (LEDs, IR detectors, laser diodes)
Fiber Optic Assemblies
Aerospace Electronics (NASA low-outgassing compliant)
Automotive Sensors & MEMS
Medical Electronics (USP Class VI compatibility)
PCB and SMT Assembly
High-Power RF & Microwave Devices
| Property | Value | Standard / Notes |
|---|---|---|
| Components | Two-part (A/B) | – |
| Mix Ratio | 1:1 by weight | – |
| Color (Uncured) | Silver / Silver |
H20E |
| Viscosity @ 23°C | 2,200–3,200 cPs | Thixotropic paste |
| Glass Transition Temperature (Tg) | ≥ 80°C | Dynamic cure method |
| CTE Below Tg | 31 ×10⁻⁶ in/in/°C | – |
| CTE Above Tg | 158 ×10⁻⁶ in/in/°C | – |
| Shore D Hardness | 75 | – |
| Lap Shear Strength | 1,475 psi | – |
| Die Shear Strength | ≥ 10 kg / 3,556 psi | – |
| Degradation Temperature | 425°C | – |
| Thermal Conductivity | 2.5 W/m·K (Laser Flash) |
H20E |
| Thermal Conductivity (Alt.) | 29 W/m·K | Based on thermal resistance calculation |
| Volume Resistivity | ≤ 0.0004 Ω·cm | Electrically conductive |
| Pot Life | 2.5 days | At room temperature |
| Shelf Life (Bulk) | 1 year at RT | – |
| Cure Schedules | 150°C/1 hr, 150°C/5 min, 120°C/15 min, 80°C/3 hrs | Multiple fast-cure options |
| Recommended Operating Temp | < 300°C (intermittent) | – |
| Particle Size | ≤ 45 microns | – |
Authorized distributor of premium electronic adhesives and epoxies.
Supplies genuine EPO-TEK materials with full traceability & certificates.
Fast delivery to all GCC countries.
Support for semiconductor, aerospace, LED, and PCB industries.
Bulk/OEM pricing available for high-volume manufacturers.
Technical guidance available for application and processing.
Q1. What makes EPO-TEK H20E unique compared to other conductive epoxies?
It offers extremely high conductivity, NASA-approved low outgassing, and decades of proven reliability in critical electronic applications.
Q2. Can H20E withstand high temperatures?
Yes—H20E can handle 300–400°C wire bonding temperatures and operates intermittently up to 300°C.
Q3. What curing options are available?
150°C (1 hr or 5 min), 120°C (15 min), or 80°C (3 hrs) as listed in the TDS
Q4. Is H20E suitable for LED/optical applications?
Yes—it is widely used for high-power LEDs, laser diodes, detectors, and fiber optic packaging.
Q5. Do you offer certificates?
Yes, Maisam Dubai supplies Factory CoC + Technical Data Sheet + SDS on request.
Q6. Do you ship across the GCC?
Yes—UAE, Saudi Arabia, Qatar, Oman, Bahrain, and Kuwait.
Looking for EPO-TEK® H20E Electrically Conductive Silver Epoxy in the GCC?
📞 Phone: +971 52 167 2252
📩 Email: sales@maisamdubai.com
🌍 Serving: UAE, Saudi Arabia, Oman, Qatar, Bahrain, Kuwait
We offer special pricing for bulk orders. If you're looking to purchase this product in large quantities, please contact us at +97142218202 or sales@maisamdubai.com for a personalized quote.
You can find product manuals and technical specifications or download on the product page under the "Specifications" tab. If you need further assistance, please contact our support team at +97142218202 or sales@maisamdubai.com, and our experts will be happy to help.
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