Bergquist GAP FILLER TGF 1000

Bergquist GAP FILLER TGF 1000 Thermally Conductive Liquid Gap Filler

What Is Bergquist GAP FILLER TGF 1000?

Bergquist GAP FILLER TGF 1000 — also known as Bergquist GAP FILLER 1000, liquid thermal gap filler, two-part silicone gap filler, or form-in-place thermal interface material — is a thermally conductive liquid gap filling material by Bergquist (Henkel), supplied as a two-component room temperature or heat-accelerated curing system. It is engineered to deliver reliable heat transfer and minimal mechanical stress in high-reliability electronic assemblies across aerospace, defence, automotive, telecommunications, and industrial applications. Before cure, GAP FILLER TGF 1000 flows under assembly pressure like a grease — conforming to any surface geometry, filling variable gaps, and eliminating the need for specific pad thickness or die-cut shapes for individual applications. After cure, it forms a soft, compliant, dry-to-the-touch elastomer that does not pump out from the interface during thermal cycling — overcoming a key limitation of conventional thermal greases.

The exceptionally soft cured material — Shore 00 hardness of just 20 — is the defining characteristic of Bergquist GAP FILLER TGF 1000. This ultra-low modulus makes it the preferred low stress thermal interface material for the most fragile electronic assemblies, where even the modest compression forces required by stiffer gap fillers could damage delicate component leads, solder joints, or precision-tolerance packages. With a thermal conductivity of 1.0 W/mK, a 100% solids formulation producing no cure by-products, and an operating temperature range of -60°C to +175°C, it is a dependable choice for thermal management in advanced automotive HEV and NEV battery systems, densely packed PCBs, power electronics, and thermally conductive vibration dampening applications across the UAE, Saudi Arabia, Qatar, Oman, Kuwait, and Bahrain. Maisam Trading LLC is the authorised Bergquist supplier in Dubai, with stock available in cartridge and kit configurations for prompt delivery across the entire GCC region.

Description

Bergquist GAP FILLER TGF 1000 is the preferred liquid thermal gap filler when maximum material softness and ultra-low mechanical stress on components are the primary design requirements — and where a reliable, production-ready dispensing format is needed. Available from Maisam Trading LLC Dubai, this two-part silicone gap filler mixes at a simple 1:1 ratio by weight and volume and can be dispensed directly into the interface gap using dual-tube cartridge packs with static mixers and a manual or pneumatic gun, or through industry-standard high-volume automated mixing and dispensing equipment — making it equally suited to low-volume MRO and repair operations and high-volume OEM production lines.

The pot life at 25°C is 15 minutes to doubling of viscosity, and the standard cure schedule is 60 to 120 minutes at 25°C or 5 minutes at 100°C for accelerated processing. The 100% solids formulation contains no cure by-products, making it safe for use in sealed assemblies and with sensitive electronic materials. The cured elastomer has a Shore 00 hardness of 20 — softer than any solid gap pad — and provides excellent wet-out for uniform thermal contact across variable or irregular mating surfaces, improving thermal performance in applications where surface flatness cannot be guaranteed. With a dielectric strength of 500 V/mil, volume resistivity of 1×10¹¹ ohm-cm, and UL94 V-0 flame retardancy, it meets both the electrical isolation and fire safety requirements of mission-critical assemblies in aerospace, defence, and automotive environments. As a trusted Bergquist GAP FILLER 1000 GCC supplier, Maisam Trading LLC stocks this product in cartridge and kit configurations for prompt delivery across Dubai, Saudi Arabia, Qatar, Oman, Kuwait, and Bahrain.

Features & Benefits

• Thermal conductivity — 1.0 W/mK (ASTM D5470)
• Ultra-conformable — designed for fragile and low-stress applications
• Exceptionally soft cured material — Shore 00 hardness of 20
• Liquid form — flows under pressure to fill any gap, eliminating need for specific pad thickness or die-cut shapes
• After cure — dry to the touch, does not pump out during thermal cycling
• Room temperature cure (60–120 min @ 25°C) or accelerated cure (5 min @ 100°C)
• 100% solids — no cure by-products
• Excellent low and high temperature mechanical and chemical stability
• UL94 V-0 flame retardancy
• Operating temperature range: -60°C to +175°C
• Dispensable via manual, pneumatic, or automated mixing and dispensing systems
• Available in cartridges and kits

Applications

• Automotive electronics — HEV, NEV, and battery thermal management
• Computer and peripheral component-to-chassis thermal coupling
• Heat-generating semiconductor to heat sink interfaces
• Telecommunications equipment heat dissipation
• Thermally conductive vibration dampening
• Power devices and control modules in densely packed PCB assemblies
• Aerospace, defence, and industrial OEM thermal interface applications

Industries Served

• Aerospace & Defence
• Automotive & EV Electronics
• Consumer & Industrial Electronics Manufacturing
• Telecommunications & Data Communications
• Oil & Gas Instrumentation
• Aviation MRO

Why Buy from MAISAM TRADING LLC?

• 18+ years of experience supplying Bergquist and Henkel thermal management products across the GCC
• Available in cartridge and kit configurations for manual and automated dispensing
• Dedicated B2B support and technical guidance
• Prompt delivery and export solutions across UAE, Saudi Arabia, Qatar, Oman, Kuwait & Bahrain
• Verified stock of original Bergquist (Henkel) products
• Call: +971521672252 | Email: sales@maisamdubai.com

Technical Specifications

FAQs

Q1: What is Bergquist GAP FILLER TGF 1000 used for? Bergquist GAP FILLER TGF 1000 is a 2-component liquid thermally conductive silicone gap filler used to thermally couple heat-generating electronic components to heat sinks or metal cases. It is ideal for automotive HEV and NEV battery thermal management, power electronics, telecommunications, and aerospace and industrial OEM assemblies where a soft, low-stress, form-in-place gap filler is required.

Q2: What makes GAP FILLER TGF 1000 different from GAP FILLER TGF 2000? GAP FILLER TGF 1000 has a lower thermal conductivity of 1.0 W/mK versus 2.0 W/mK for TGF 2000, a significantly softer cured material (Shore 00: 20 vs 70), and a lower operating temperature ceiling of 175°C vs 200°C. TGF 1000 is the preferred choice when ultra-low mechanical stress on fragile components is the primary requirement and moderate thermal conductivity is sufficient.

Q3: What is the cure schedule for Bergquist GAP FILLER TGF 1000? The standard cure is 60 to 120 minutes at 25°C or 5 minutes at 100°C for accelerated processing. These are guideline recommendations — actual cure conditions may vary based on application requirements, oven loading, and equipment.

Q4: Can Bergquist GAP FILLER TGF 1000 be used in automated dispensing systems? Yes. It is compatible with dual-tube cartridge packs with static mixers for manual or pneumatic dispensing, and with industry-standard high-volume automated mixing and dispensing equipment — making it suitable for both low-volume MRO repair and high-volume OEM production.

Q5: Does GAP FILLER TGF 1000 pump out during thermal cycling? No. Once cured, GAP FILLER TGF 1000 forms a stable, dry-to-the-touch elastomer that does not pump out from the interface as a result of thermal cycling — maintaining consistent thermal contact throughout the service life of the assembly.

Q6: Is Bergquist GAP FILLER TGF 1000 suitable for aerospace and defence applications? Yes. With an operating temperature range of -60°C to +175°C, UL94 V-0 flame retardancy, a 100% solids formulation, and excellent mechanical and chemical stability at low and high temperatures, TGF 1000 meets the requirements of aerospace, aviation MRO, and defence electronics thermal management applications.

Q7: How should Bergquist GAP FILLER TGF 1000 be stored? Store in the unopened container in a dry location at 5°C to 25°C for a shelf life of 6 months. Do not return material to the original container once removed, as contamination may affect performance.

Q8: Where can I buy Bergquist GAP FILLER TGF 1000 in the UAE or GCC? Maisam Trading LLC is a trusted Bergquist (Henkel) supplier in Dubai. Contact +971521672252 or email sales@maisamdubai.com. We supply across UAE, Saudi Arabia, Qatar, Oman, Kuwait, and Bahrain.

Q9: Is bulk purchasing available? Yes. Maisam Trading LLC offers competitive pricing for bulk and B2B orders across the GCC. Contact our sales team for a customised quote.

Availability & Support

Bergquist GAP FILLER TGF 1000 Thermally Conductive Liquid Gap Filler is available across Dubai and all major GCC aerospace, defence, automotive, and electronics supply networks through Maisam Trading LLC.

• Call / WhatsApp: +971521672252
• Email: sales@maisamdubai.com for quotes, TDS, SDS, cartridge sizes, or bulk order pricing