Bergquist GAP PAD TGP A2000

Bergquist GAP PAD TGP A2000 Thermally Conductive Gap Filling Pad

What Is Bergquist GAP PAD TGP A2000?

Bergquist GAP PAD TGP A2000 — also known as Bergquist GAP PAD A2000, thermally conductive gap pad, electrically isolating thermal interface pad, or fiberglass reinforced TIM — is a high-performance silicone-based thermally conductive gap filling material by Bergquist (Henkel) engineered to act simultaneously as a thermal interface and an electrical insulator between heat-generating electronic components and their adjacent heat sinks or metal chassis. Unlike single-function thermal greases or non-electrically-isolating interface materials, GAP PAD TGP A2000 combines a thermal conductivity of 2.0 W/mK with a volume resistivity of 1×10¹¹ ohm-meter and a dielectric breakdown voltage exceeding 4,000 VAC — making it an essential thermal management pad for assemblies where electrical isolation between the component and heat sink is a critical design requirement.

The Bergquist GAP PAD TGP A2000 is available in thicknesses from 0.254mm to 1.016mm (10 to 40 mil) and supplied with natural tack on both sides throughout this range, enabling excellent conformity to adjacent component surfaces and consistent thermal contact across uneven or contoured mating interfaces. At the 40 mil (1.016mm) maximum thickness, the pad is supplied with reduced tack on one side to support burn-in processes and facilitate easy rework during assembly — a critical feature for production environments requiring repeated installation and removal. Fiberglass reinforcement throughout the thickness range provides improved puncture, shear, and tear resistance, supporting durability during handling, converting, and installation in demanding electronics manufacturing and MRO environments. Maisam Trading LLC is the authorised Bergquist supplier in Dubai, with stock available in sheet, roll, and die-cut configurations for prompt delivery across the UAE, Saudi Arabia, Qatar, Oman, Kuwait, and Bahrain.

Description

Bergquist GAP PAD TGP A2000 is the go-to electrically isolating thermal interface material for computer and peripheral, telecommunications, CPU-to-heat-spreader, heat pipe assembly, memory module, and chassis thermal management applications requiring both reliable heat transfer and electrical isolation in a single material. Available from Maisam Trading LLC Dubai, this fiberglass-reinforced silicone thermal pad delivers 2.0 W/mK thermal conductivity with thermal impedance values ranging from 1.04 °C-in²/W at 10% deflection to 0.95 °C-in²/W at 30% deflection — providing consistent thermal performance that improves with increasing mounting pressure.

The Shore 00 hardness of 80 and Young’s Modulus of 379 kPa (55 psi) give GAP PAD TGP A2000 a firm yet flexible character that ensures it fills the interface gap effectively while maintaining the mechanical integrity needed for reliable long-term service in dynamic environments. With an operating temperature range of -60°C to +200°C and UL94 V-0 flame retardancy, it fully meets the thermal and safety requirements of aerospace, industrial electronics, and high-reliability OEM applications across the GCC — where the combination of high ambient temperatures, humidity, and demanding duty cycles makes robust thermal management essential.

Available in sheet, roll, and custom die-cut configurations, Bergquist GAP PAD TGP A2000 can be supplied in any shape or size to match existing assembly footprints or new design requirements. As a trusted thermal management pad UAE and GCC supplier, Maisam Trading LLC stocks GAP PAD TGP A2000 for prompt delivery across Dubai, Saudi Arabia, Qatar, Oman, Kuwait, and Bahrain. Prior trials on the specific application are recommended to confirm suitability, as actual thermal performance is directly related to surface roughness, flatness, and the pressure applied.

Features & Benefits

• Thermal conductivity — 2.0 W/mK (ASTM D5470)
• Electrically isolating — dielectric breakdown voltage >4,000 VAC, volume resistivity 1×10¹¹ ohm-meter
• Natural tack on both sides (10–40 mil range) — excellent surface conformity and improved thermal contact
• 40 mil thickness — reduced tack on one side for burn-in processes and easy rework
• Fiberglass reinforced — improved puncture, shear, and tear resistance
• UL94 V-0 flame retardancy
• Operating temperature range: -60°C to +200°C
• Available in sheet, roll, and custom die-cut configurations
• 12-month shelf life at optimal storage conditions

Applications

• Computer and peripherals — component to chassis thermal coupling
• CPU to heat spreader interface
• Telecommunications equipment heat dissipation
• Heat pipe assemblies
• RDRAM and DDR SDRAM memory modules
• CDROM / DVD cooling
• Frame chassis and heat spreader thermal interfaces
• Aerospace, defence, and industrial OEM thermal management

Industries Served

• Consumer & Industrial Electronics Manufacturing
• Telecommunications & Data Centre Equipment
• Aerospace & Defence
• Automotive & EV Electronics
• Computing & Semiconductor Manufacturing
• Oil & Gas Instrumentation

Why Buy from MAISAM TRADING LLC?

• 18+ years of experience supplying Bergquist and Henkel thermal management products across the GCC
• Available in sheet, roll, and custom die-cut configurations
• Dedicated B2B support and technical guidance
• Prompt delivery and export solutions across UAE, Saudi Arabia, Qatar, Oman, Kuwait & Bahrain
• Verified stock of original Bergquist (Henkel) products
• Call: +971521672252 | Email: sales@maisamdubai.com

Technical Specifications

FAQs

Q1: What is Bergquist GAP PAD TGP A2000 used for? Bergquist GAP PAD TGP A2000 acts as both a thermal interface and an electrical insulator between heat-generating electronic components and heat sinks or chassis. It is used in computer and peripheral, CPU-to-heat-spreader, telecommunications, heat pipe assembly, memory module, and general OEM and MRO thermal management applications.

Q2: What is the thermal conductivity of GAP PAD TGP A2000? GAP PAD TGP A2000 delivers a thermal conductivity of 2.0 W/mK (ASTM D5470). Thermal impedance ranges from 1.04 to 0.95 °C-in²/W at deflections from 10% to 30%, improving with increased mounting pressure.

Q3: What makes GAP PAD TGP A2000 electrically isolating? It has a dielectric breakdown voltage exceeding 4,000 VAC and a volume resistivity of 1×10¹¹ ohm-meter — providing reliable electrical isolation between components and heat sinks, eliminating the need for a separate insulating layer in the thermal stack.

Q4: Why does the 40 mil thickness have reduced tack on one side? At the 40 mil (1.016mm) maximum thickness, one side of the pad is supplied with reduced tack to support burn-in processes and to enable easy rework and repeated removal and reinstallation during assembly and testing — without leaving excessive adhesive residue on the component or heat sink surface.

Q5: What thickness options are available for GAP PAD TGP A2000? The standard thickness range is 0.254mm to 1.016mm (10 to 40 mil). Contact Maisam Trading LLC for the specific thicknesses available in sheet, roll, or die-cut form.

Q6: Is Bergquist GAP PAD TGP A2000 suitable for aerospace and defence applications? Yes. With an operating temperature range of -60°C to +200°C, UL94 V-0 flame retardancy, fiberglass reinforcement, and electrical isolation properties, GAP PAD TGP A2000 meets the requirements of aerospace, aviation MRO, and defence electronics thermal management applications.

Q7: How should Bergquist GAP PAD TGP A2000 be stored? Store in the unopened container at 25°C (±3°C) and 50% relative humidity (±10%) for a shelf life of 12 months. Do not return material to the original container once removed.

Q8: What configurations is GAP PAD TGP A2000 available in? It is available in sheet form, roll form, and custom die-cut parts in any shape or size. Contact Maisam Trading LLC for custom configuration requirements.

Q9: Where can I buy Bergquist GAP PAD TGP A2000 in the UAE or GCC? Maisam Trading LLC is a trusted Bergquist (Henkel) supplier in Dubai. Contact +971521672252 or email sales@maisamdubai.com. We supply across UAE, Saudi Arabia, Qatar, Oman, Kuwait, and Bahrain.

Q10: What is the difference between GAP PAD TGP A2000 and GAP PAD TGP 5000? GAP PAD TGP 5000 has a significantly higher thermal conductivity of 5.0 W/mK and S-Class softness (Shore 00: 35) for very low-pressure applications, while GAP PAD TGP A2000 offers 2.0 W/mK with a firmer Shore 00 hardness of 80 and is specifically designed as an electrically isolating thermal interface pad for CPU, memory, heat pipe, and general electronics cooling applications.

Availability & Support

Bergquist GAP PAD TGP A2000 Thermally Conductive Gap Filling Pad is available across Dubai and all major GCC aerospace, defence, electronics, and industrial supply networks through Maisam Trading LLC.

• Call / WhatsApp: +971521672252
• Email: sales@maisamdubai.com for quotes, TDS, SDS, thickness options, custom die-cut configurations, or bulk order pricing