BERGQUIST GAP FILLER TGF3600

BERGQUIST GAP FILLER TGF3600(8679001325 GF3500S35-07-60-6 G) – 6G Syringe

What Is Bergquist GAP FILLER TGF 3600?

Bergquist GAP FILLER TGF 3600 — also known as Bergquist GAP FILLER 3500S35, high thermal conductivity liquid gap filler, or thixotropic thermal interface material — is a two-component, room temperature or heat-curable, thermally conductive liquid gap filling silicone material by Bergquist (Henkel), engineered to deliver ultra-high thermal performance with superior softness for the most demanding fragile and low-stress electronics assemblies. With a thermal conductivity of 3.6 W/mK and a cured Shore 00 hardness of just 35 — matching the S-Class softness standard — GAP FILLER TGF 3600 provides a unique combination of high-performance heat transfer and exceptional material compliance that makes it the preferred two-part silicone gap filler for interfacing fragile components with high topography or stack-up tolerances to universal heat sinks or housings.

Before cure, GAP FILLER TGF 3600 behaves as a gel-like thixotropic liquid — it flows freely when acted upon by an external force such as dispensing or assembly pressure, but holds its position at rest, providing excellent vertical gap stability and preventing slumping or migration after application. After cure, it becomes a low-modulus elastomer that lightly adheres to surfaces to maximise contact area and thermal performance, while maintaining sufficient modulus to prevent pump-out from the interface during repeated thermal cycling across -60°C to +200°C. Note that this material is not designed to be a structural adhesive. Available in a convenient 6g syringe format (Part No. 8679001325, GF3500S35-07-60-6 G) as well as cartridges and kits, Bergquist GAP FILLER TGF 3600 is the automotive thermal gap filler and PCBA thermal interface material trusted by HEV, NEV, telecommunications, and industrial OEM engineers across the UAE, Saudi Arabia, Qatar, Oman, Kuwait, and Bahrain. Maisam Trading LLC is the authorised Bergquist supplier in Dubai with stock available for prompt delivery across the entire GCC region.

Description

Bergquist GAP FILLER TGF 3600 is the highest-conductivity liquid gap filler in the Bergquist GAP FILLER family available from Maisam Trading LLC Dubai, combining a thermal conductivity of 3.6 W/mK with ultra-soft Shore 00 hardness of 35 for the most thermally demanding yet mechanically sensitive assembly applications. The two-part 1:1 by weight and volume formulation is supplied ready to mix, with a pot life of 60 minutes at 25°C and a shelf life of 150 days at 25°C. The mixed material has a viscosity of 150,000 mPa·s and strong thixotropic characteristics that enable precise dispensing into complex geometries, vertical gaps, and high-topography assemblies without slumping or bridging.

The 3.6 W/mK thermal conductivity makes GAP FILLER TGF 3600 particularly well suited to automotive HEV and NEV battery thermal management, PCBA-to-housing thermal coupling, discrete component-to-housing attachment, and fiber optic telecommunications equipment — applications where heat flux densities are high and the thermal interface material must conform precisely to the actual gap geometry. The cured elastomer’s mild elastic properties relieve CTE stresses during thermal cycling while the light surface adhesion maximises interfacial contact area — both critical to sustained thermal performance over thousands of thermal cycles in the demanding ambient conditions of the UAE and wider GCC region. UL94 V-0 flame retardancy and an operating temperature range of -60°C to +200°C confirm its suitability for mission-critical electronics environments. For UL certification details refer to UL file No. E59150. As a trusted high thermal conductivity gap filler GCC supplier, Maisam Trading LLC stocks Bergquist GAP FILLER TGF 3600 in 6g syringe, cartridge, and kit configurations for prompt delivery across Dubai, Saudi Arabia, Qatar, Oman, Kuwait, and Bahrain. BERGQUIST GAP FILLER TGF3600

Features & Benefits

• Ultra-high thermal conductivity — 3.6 W/mK (ASTM D5470)
• Thixotropic before cure — excellent vertical gap stability, flows under dispensing force and holds shape at rest
• Ultra-conformable — Shore 00 hardness of 35 after cure for fragile and low-stress applications
• Low modulus cured elastomer — minimises CTE stresses during thermal cycling
• Lightly adheres to surfaces — improves surface area contact and thermal performance
• Does not pump out from the interface during thermal cycling
• Room temperature cure (15 hours at 25°C) or accelerated cure (30 minutes at 100°C)
• Two-part formulation for easy storage at room temperature
• UL94 V-0 flame retardancy — UL file No. E59150
• Operating temperature range: -60°C to +200°C
• 60-minute pot life at 25°C | 150-day shelf life at 25°C
• Available in 6g syringe, cartridges, and kits

Applications

• Automotive electronics — HEV, NEV, and battery module thermal management
• PCBA assembly to housing thermal coupling
• Discrete component to housing interface
• Fiber optic telecommunications equipment thermal management
• Fragile and high-topography component interfaces to heat sinks
• High thermal flux density electronics assemblies requiring ultra-soft gap filling

Industries Served

• Automotive & EV Electronics
• Telecommunications & Data Communications
• Consumer & Industrial Electronics Manufacturing
• Aerospace & Defence
• Oil & Gas Instrumentation
• Aviation MRO

Why Buy from MAISAM TRADING LLC?

• 18+ years of experience supplying Bergquist and Henkel thermal management products across the GCC
• Available in 6g syringe, cartridge, and kit configurations
• Dedicated B2B support and technical guidance
• Prompt delivery and export solutions across UAE, Saudi Arabia, Qatar, Oman, Kuwait & Bahrain
• Verified stock of original Bergquist (Henkel) products
• Call: +971521672252 | Email: sales@maisamdubai.com

Technical Specifications

FAQs

Q1: What is Bergquist GAP FILLER TGF 3600 used for? It is a two-part thermally conductive liquid gap filler used for thermal management of automotive HEV and NEV battery electronics, PCBA to housing thermal coupling, discrete component to housing attachment, and fiber optic telecommunications equipment. It is specifically designed for fragile and high-topography applications requiring both ultra-high thermal conductivity and exceptional material softness.

Q2: What is the thermal conductivity of GAP FILLER TGF 3600? GAP FILLER TGF 3600 delivers a thermal conductivity of 3.6 W/mK (ASTM D5470) — the highest of the Bergquist liquid gap filler range, making it the preferred choice for the most thermally demanding electronics assemblies.

Q3: What does thixotropic mean for this material? Thixotropic means the material behaves as a gel at rest — holding its shape and position after dispensing — but flows freely when force is applied (dispensing, assembly pressure). This provides excellent vertical gap stability, preventing slumping or migration after application, while still conforming fully to complex surface geometries during assembly.

Q4: What is the cure schedule for Bergquist GAP FILLER TGF 3600? Standard cure is 15 hours at 25°C. For accelerated processing, 30 minutes at 100°C achieves 90% cure. These are guideline recommendations — actual conditions may vary based on equipment, oven loading, and application requirements.

Q5: Is GAP FILLER TGF 3600 a structural adhesive? No. GAP FILLER TGF 3600 is specifically designed as a thermal interface material, not a structural adhesive. It lightly adheres to surfaces to maximise contact area and thermal performance, but it is not formulated to provide structural bonding strength.

Q6: Does GAP FILLER TGF 3600 pump out during thermal cycling? No. The cured low-modulus elastomer maintains sufficient stiffness to prevent pump-out from the interface during thermal cycling, while remaining soft enough to relieve CTE stresses and maintain conformity to mating surfaces.

Q7: What format is the 6g syringe suitable for? The 6g syringe (Part No. 8679001325, GF3500S35-07-60-6 G) is ideal for low-volume applications, prototyping, laboratory evaluation, and repair or rework operations. Cartridge and kit configurations are available for higher-volume production use.

Q8: Where can I buy Bergquist GAP FILLER TGF 3600 in the UAE or GCC? Maisam Trading LLC is a trusted Bergquist (Henkel) supplier in Dubai. Contact +971521672252 or email sales@maisamdubai.com. We supply across UAE, Saudi Arabia, Qatar, Oman, Kuwait, and Bahrain. BERGQUIST GAP FILLER TGF3600

Q9: What is the difference between GAP FILLER TGF 3600 and GAP FILLER TGF 2000? GAP FILLER TGF 3600 has a significantly higher thermal conductivity of 3.6 W/mK versus 2.0 W/mK for TGF 2000, an identical cured Shore 00 hardness of 35 for both, and a longer standard room temperature cure time. TGF 3600 is the preferred choice when maximum thermal performance is required alongside the same level of ultra-soft material compliance.

Q10: Is bulk purchasing available? Yes. Maisam Trading LLC offers competitive pricing for bulk and B2B orders across the GCC. Contact our sales team for a customised quote.

Availability & Support

Bergquist GAP FILLER TGF 3600 Thermally Conductive Liquid Gap Filler is available across Dubai and all major GCC automotive, telecommunications, aerospace, and electronics supply networks through Maisam Trading LLC.

• Call / WhatsApp: +971521672252
• Email: sales@maisamdubai.com for quotes, TDS, SDS, syringe, cartridge or kit configurations, or bulk order pricing