Bergquist GAP FILLER TGF 2000

Description

Bergquist GAP FILLER TGF 2000 Thermally Conductive Liquid Gap Filler

What Is Bergquist GAP FILLER TGF 2000?

Bergquist GAP FILLER TGF 2000 — also known as Bergquist GAP FILLER 2000, liquid thermal gap filler, form-in-place thermal interface material, or 2-part silicone gap filler — is a high-performance, thermally conductive liquid silicone gap filling material by Bergquist (Henkel), supplied as a two-component room temperature or heat-curing system engineered for high-reliability aerospace, aviation, defence, OEM, and MRO applications. Unlike rigid thermal pads or die-cut gap fillers that require precise thickness matching and custom shapes for each application, GAP FILLER TGF 2000 is a liquid that flows under pressure like a grease before cure — conforming to any surface geometry, filling any gap thickness, and eliminating the need for specific pad sizes or die-cut shapes for individual assemblies. After cure, it forms a soft, pliable, low-modulus thermal interface material elastomer that is dry to the touch and does not pump out from the interface as a result of thermal cycling.

The Bergquist GAP FILLER TGF 2000 is specifically engineered as an ultra-conformable gap filler for fragile and low-stress applications where conventional solid pads may apply excessive mechanical stress to sensitive component leads, solder joints, or tolerance-sensitive assemblies. With a thermal conductivity of 2.0 W/mK, a Shore 00 hardness of 70, and an operational temperature range of -60°C to +200°C, it provides reliable, long-term thermal management performance across the most demanding aerospace, automotive electronics, telecommunications, and industrial environments — including the harsh heat, humidity, and temperature cycling conditions typical of UAE, Saudi Arabia, Qatar, Oman, Kuwait, and Bahrain. Maisam Trading LLC is the authorised Bergquist supplier in Dubai with stock available for prompt delivery across the entire GCC region.

Description

Bergquist GAP FILLER TGF 2000 is the preferred liquid thermal gap filler for high-reliability thermal management applications where a fixed-thickness solid pad is impractical or where assembly complexity demands a material that conforms perfectly to the actual gap without stress. Available from Maisam Trading LLC Dubai, this two-part silicone gap filler is mixed at a simple 1:1 ratio by weight and volume, then dispensed directly into the interface gap between heat-generating electronic components and their adjacent metal cases or heat sinks — flowing under assembly pressure to fill the gap completely before curing in place.

The cured material properties of Bergquist GAP FILLER TGF 2000 are specifically formulated for low-stress applications. The pliable, low-modulus elastomer (Shore 00 hardness: 70) maintains its mechanical compliance and compression set performance throughout thousands of thermal cycles from -60°C to +200°C, ensuring consistent thermal contact is maintained over the full service life of the assembly. The 100% solids formulation produces no cure by-products, making it compatible with sensitive electronic components and sealed assemblies. The cured surface is dry to the touch and electrically insulating, with a volume resistivity of 1×10¹¹ ohm-meter and dielectric strength of 500 V/mil, making it safe for direct contact with PCB tracks and component bodies.

Multiple cure schedules provide production flexibility — 1 to 2 hours at 25°C, 5 minutes at 100°C, or 3 days at ambient temperature for large production runs. As a trusted form in place thermal interface material GCC supplier, Maisam Trading LLC stocks Bergquist GAP FILLER TGF 2000 in both cartridge and kit configurations for prompt delivery across Dubai, Saudi Arabia, Qatar, Oman, Kuwait, and Bahrain.

Features & Benefits

• Thermal conductivity — 2.0 W/mK (ASTM D5470)
• Ultra-conformable — designed for fragile and low-stress applications
• Liquid form — flows under pressure to fill any gap, eliminating need for specific pad thickness or die-cut shapes
• After cure — dry to the touch, does not pump out during thermal cycling
• Ambient and accelerated cure schedules — production flexibility
• 100% solids — no cure by-products
• Excellent low and high temperature mechanical and chemical stability
• Low modulus formulation with reliable compression set performance
• UL94 V-0 flame retardancy
• Operating temperature range: -60°C to +200°C
• Available in cartridges and kits

Applications

• Automotive electronics — HEV, NEV, and battery thermal management
• Telecommunications equipment heat dissipation
• Computers and peripherals — component to chassis coupling
• Thermally conductive vibration dampening
• Heat-generating semiconductors to heat sink interfaces
• Advanced aircraft avionics and power electronics thermal management
• OEM and MRO thermal interface applications requiring form-in-place gap filling

Industries Served

• Aerospace & Defence
• Aviation MRO (Maintenance, Repair & Overhaul)
• Automotive & EV Electronics
• Telecommunications & Data Communications
• Consumer & Industrial Electronics Manufacturing
• Oil & Gas Instrumentation

Why Buy from MAISAM TRADING LLC?

• 18+ years of experience supplying Bergquist and Henkel thermal management products across the GCC
• Available in cartridge and kit configurations
• Dedicated B2B support and technical guidance
• Prompt delivery and export solutions across UAE, Saudi Arabia, Qatar, Oman, Kuwait & Bahrain
• Verified stock of original Bergquist (Henkel) products
• Call: +971521672252 | Email: sales@maisamdubai.com

Technical Specifications

FAQs

Q1: What is Bergquist GAP FILLER TGF 2000 used for? Bergquist GAP FILLER TGF 2000 is a 2-component liquid thermally conductive silicone gap filler used to thermally couple heat-generating electronic components to adjacent heat sinks or metal cases. It is used in aerospace, defence, automotive electronics, telecommunications, and OEM thermal management applications where a liquid form-in-place material is required to fill irregular gaps without mechanical stress.

Q2: What is the difference between GAP FILLER TGF 2000 and a solid thermal pad like GAP PAD TGP 5000? GAP FILLER TGF 2000 is a liquid that is dispensed, flows to fill the gap under assembly pressure, and then cures in place — eliminating the need for specific pad thickness matching or die-cut shapes. GAP PAD TGP 5000 is a pre-formed solid pad with a fixed thickness. GAP FILLER TGF 2000 is preferred for complex geometries, variable gap sizes, or assemblies where a solid pad would apply excessive stress to fragile components.

Q3: What is the cure schedule for Bergquist GAP FILLER TGF 2000? Three cure options are available: 1 to 2 hours at 25°C with 5 minutes at 100°C; 3 to 4 hours at 25°C with 15 minutes at 100°C; or 3 days at 25°C with 1 hour at 100°C. All times are based on rheometer measurement to 90% cure.

Q4: Does Bergquist GAP FILLER TGF 2000 pump out during thermal cycling? No. Unlike uncured gap filling materials or thermal greases, GAP FILLER TGF 2000 cures to a solid, dry-to-the-touch elastomer that does not pump out from the interface as a result of thermal cycling — maintaining consistent thermal contact throughout the service life of the assembly.

Q5: What is the thermal conductivity of GAP FILLER TGF 2000? Bergquist GAP FILLER TGF 2000 delivers a thermal conductivity of 2.0 W/mK (ASTM D5470), making it suitable for moderate to high thermal load applications in electronics assemblies across aerospace, automotive, and industrial environments.

Q6: Is Bergquist GAP FILLER TGF 2000 suitable for aerospace and defence applications? Yes. With an operating temperature range of -60°C to +200°C, UL94 V-0 flame retardancy, excellent low and high temperature mechanical and chemical stability, and a 100% solids formulation with no cure by-products, GAP FILLER TGF 2000 fully meets the demands of aerospace, aviation MRO, and defence electronics thermal management applications.

Q7: How should Bergquist GAP FILLER TGF 2000 be stored? Store in sealed containers with moisture barrier packaging at 5°C to 25°C for a shelf life of 6 months. Do not return used material to the original container.

Q8: What configurations is GAP FILLER TGF 2000 available in? It is available in cartridges and kits. Contact Maisam Trading LLC for specific cartridge sizes and quantities available for your application.

Q9: Where can I buy Bergquist GAP FILLER TGF 2000 in the UAE or GCC? Maisam Trading LLC is a trusted Bergquist (Henkel) supplier in Dubai. Contact +971521672252 or email sales@maisamdubai.com. We supply across UAE, Saudi Arabia, Qatar, Oman, Kuwait, and Bahrain.

Q10: Is bulk purchasing available? Yes. Maisam Trading LLC offers competitive pricing for bulk and B2B orders across the GCC. Contact our sales team for a customised quote.

Availability & Support

Bergquist GAP FILLER TGF 2000 Thermally Conductive Liquid Gap Filler is available across Dubai and all major GCC aerospace, defence, automotive, and electronics supply networks through Maisam Trading LLC.

• Call / WhatsApp: +971521672252
• Email: sales@maisamdubai.com for quotes, TDS, SDS, cartridge sizes, or bulk order pricing